EPOXY RESIN MOLDING MATERIAL FOR SEALING AND ELECTRONIC PART DEVICE

PROBLEM TO BE SOLVED: To provide an epoxy resin molding material for sealing having excellent fluidity and solder reflow resistance without deteriorating curability, and to provide an electronic part device equipped with an element sealed with the molding material. SOLUTION: The epoxy resin molding...

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Bibliographische Detailangaben
Hauptverfasser:	HAMADA MITSUYOSHI, NAGAI AKIRA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an epoxy resin molding material for sealing having excellent fluidity and solder reflow resistance without deteriorating curability, and to provide an electronic part device equipped with an element sealed with the molding material. SOLUTION: The epoxy resin molding material for sealing comprises (A) an epoxy resin, (B) a curing agent, and (C) a phthalimide compound represented by general formula (I) (wherein, R1represents a hydrogen atom, a halogen atom, a hydroxy group, an amino group, a monovalent hydrocarbon group which may have a substituent or a hetero group having an organic group; R2to R5represent each a hydrogen atom, a halogen atom, a nitro group or an amino group; and may be same or different). COPYRIGHT: (C)2009,JPO&INPIT