PACKAGE FOR STORING ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To provide a package for storing electronic components capable of preventing the occurrence of cracks caused by thermal stress concentrating at a through-hole provided on a ceramic substrate and at a cutout section. SOLUTION: In the package 10 for storing electronic components that has a mounting section 13 for mounting an electronic component 12 onto an upper surface, and stores the electronic component 12 in a space 17 formed by the nearly flat ceramic substrate 11 having the through-hole 14 provided from the upper to lower surface and a window-frame-like frame body 16 provided at the outer-periphery section of the upper surface of the ceramic substrate 11, there is a concentric metalized film 18 at the outer-periphery section of the through-hole 14 at the lower surface side of the ceramic substrate 11. COPYRIGHT: (C)2009,JPO&INPIT