SEMICONDUCTOR DEVICE AND METHOD OF BUMP FORMATION

PROBLEM TO BE SOLVED: To provide a semiconductor device, the bump of which has a flatter surface. SOLUTION: The semiconductor device including a semiconductor substrate, a contact pad, a protective film, a bump, and a seeding layer is provided. The semiconductor substrate has an active surface. The contact pad is disposed on the active surface. The protective film is disposed on the active surface and exposes a central part of the contact pad. The seeding layer is disposed on the exposed central part of the contact pad. The bump has a top surface, a bottom surface opposite to the top surface, and a side surface connecting the top surface and the bottom surface. The bump is disposed on the seeding layer. The bump is placed in contact with the seeding layer by the bottom surface and by part of the side surface. COPYRIGHT: (C)2009,JPO&INPIT