SEMICONDUCTOR PACKAGE WITH CONNECTOR

PROBLEM TO BE SOLVED: To reduce manufacturing man-hours while obtaining a structure from which a terminal serving as a male terminal and a connector guide for guiding insertion of a female terminal to be engaged and connected with the male terminal are integrally derived, and to provide a more produ...

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Bibliographische Detailangaben
1. Verfasser: TAJIMA KIYONARI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To reduce manufacturing man-hours while obtaining a structure from which a terminal serving as a male terminal and a connector guide for guiding insertion of a female terminal to be engaged and connected with the male terminal are integrally derived, and to provide a more productive semiconductor package with a connector. SOLUTION: In the semiconductor package with a connector, leads 32a-32c of a primarily molded semiconductor package serve as the male terminals of the connector as they are. The connector guide 40 for guiding insertion of a holder 50 of the female terminals 50a-50c to be engaged and connected with the leads 32a-32c is primarily molded in a form surrounding the leads 32a-32c. The whole semiconductor package thus molded is secondarily molded of a resin member 21. COPYRIGHT: (C)2009,JPO&INPIT