EMI ABSORBING COMPONENT, AND EMI ABSORBING METHOD

EMI ABSORBING COMPONENT, AND EMI ABSORBING METHOD

PROBLEM TO BE SOLVED: To provide an EMI absorbing component with which measures can be easily taken inexpensively against unexpected EMI without previously taking measures by a mounted pattern, structure, etc., when a printed circuit board or semiconductor integrated circuit is manufactured. SOLUTIO...

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Bibliographische Detailangaben
Hauptverfasser: NAKAMURA SATOSHI, NOMA TATSUJI, SUGA TAKU, YOKOTA HITOSHI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide an EMI absorbing component with which measures can be easily taken inexpensively against unexpected EMI without previously taking measures by a mounted pattern, structure, etc., when a printed circuit board or semiconductor integrated circuit is manufactured. SOLUTION: Disclosed is the EMI absorbing component having an electronic circuit composed of a first means of absorbing electromagnetic energy, a second means of transmitting the electromagnetic energy absorbed by the first means, and a third means of converting the electromagnetic energy absorbed by the first means into other energy, at least two or more of the first means, second means and third means being constituted in the same element. COPYRIGHT: (C)2009,JPO&INPIT