LIQUID EJECTION HEAD AND METHOD FOR MANUFACTURING LIQUID EJECTION HEAD

PROBLEM TO BE SOLVED: To obtain a liquid ejection head where an element substrate equipped with a discharge energy generating element and a wiring board are precisely connected while securing miniaturization of the liquid ejection head and refill performance of liquid. SOLUTION: A forming position o...

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Bibliographische Detailangaben
1. Verfasser:	MUKAI YOSHIYO
Format:	Patent
Sprache:	eng
Schlagworte:	CORRECTION OF TYPOGRAPHICAL ERRORS i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME LINING MACHINES PERFORMING OPERATIONS PRINTING SELECTIVE PRINTING MECHANISMS STAMPS TRANSPORTING TYPEWRITERS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To obtain a liquid ejection head where an element substrate equipped with a discharge energy generating element and a wiring board are precisely connected while securing miniaturization of the liquid ejection head and refill performance of liquid. SOLUTION: A forming position of a bonding pad 9 is set to be lower than that of a heater 2 on a surface of a heater board 1 on a side opposed to an ink channel 4. COPYRIGHT: (C)2009,JPO&INPIT