METHOD FOR BONDING TANTALUM STRUCTURE TO COBALT-ALLOY SUBSTRATE
PROBLEM TO BE SOLVED: To provide a method for bonding a porous tantalum structure (10) to a substrate (12). SOLUTION: The method comprises the step of providing the substrate (12) comprising cobalt or a cobalt-chromium alloy: an interlayer (16) consisting essentially of at least one of hafnium, mang...
Gespeichert in:
Hauptverfasser: | , , , , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a method for bonding a porous tantalum structure (10) to a substrate (12). SOLUTION: The method comprises the step of providing the substrate (12) comprising cobalt or a cobalt-chromium alloy: an interlayer (16) consisting essentially of at least one of hafnium, manganese, niobium, palladium, zirconium, titanium, or alloys or combinations thereof; and the porous tantalum structure (10). Heat and pressure are applied to the substrate (12), the interlayer (16), and the porous tantalum structure (10) to achieve solid-state diffusion between the substrate (12) and the interlayer (16) and between the interlayer (16) and the porous tantalum structure (10). COPYRIGHT: (C)2009,JPO&INPIT |
---|