METHOD FOR BONDING TANTALUM STRUCTURE TO COBALT-ALLOY SUBSTRATE

PROBLEM TO BE SOLVED: To provide a method for bonding a porous tantalum structure (10) to a substrate (12). SOLUTION: The method comprises the step of providing the substrate (12) comprising cobalt or a cobalt-chromium alloy: an interlayer (16) consisting essentially of at least one of hafnium, mang...

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Bibliographische Detailangaben
Hauptverfasser: PEEK LAWRENCE F, ALLEN STEVE M, ANDERSON JEFFREY P, GORHE DEVENDRA, HIPPENSTEEL GREGORY
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a method for bonding a porous tantalum structure (10) to a substrate (12). SOLUTION: The method comprises the step of providing the substrate (12) comprising cobalt or a cobalt-chromium alloy: an interlayer (16) consisting essentially of at least one of hafnium, manganese, niobium, palladium, zirconium, titanium, or alloys or combinations thereof; and the porous tantalum structure (10). Heat and pressure are applied to the substrate (12), the interlayer (16), and the porous tantalum structure (10) to achieve solid-state diffusion between the substrate (12) and the interlayer (16) and between the interlayer (16) and the porous tantalum structure (10). COPYRIGHT: (C)2009,JPO&INPIT