MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device in which a lead is prevented from falling even when the device is made compact. SOLUTION: A lead frame 18 is prepared that has recessed portions 17' formed by half-etching on the top surfaces of leads 11. A semico...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MISUMI KAZUYUKI, HATAUCHI KAZUSHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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