MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device in which a lead is prevented from falling even when the device is made compact. SOLUTION: A lead frame 18 is prepared that has recessed portions 17' formed by half-etching on the top surfaces of leads 11. A semiconductor chip 14 is mounted on a die pad 13. The lead frame is sealed with a resin 16 at a time. The lead frame 18 sealed with the resin 16 is separated into blocks 19. In the resin sealing process, the recessed portions 17' are filled with the resin 16 from above and lower surfaces of the leads 11 are exposed in the resin 16. In a dicing process, the leads 11 are made to have cut surfaces at the recessed portions 17', and cuts 17 are formed between the top surfaces and cut surfaces of the leads 11. The cuts 17 are filled with the resin, so the leads are prevented from falling. COPYRIGHT: (C)2009,JPO&INPIT