ORGANIC INSULATING FILM AND SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide an organic insulating film which has little change in dielectric constant in the process of the organic insulating film from a drying film to a cured film and which can be cured at a relatively low temperature and in relatively short time and a semiconductor device having the same and provide the organic insulating film having a low dielectric constant and high thermal resistance and having a small rate of change of the dielectric constant with the passage of time after the last curing. SOLUTION: An organic insulating film contains a compound having a cage structure consisting of a structure using an adamantane structure as the smallest unit. In the organic insulating film, the ratio of the dielectric constant of a drying film containing the compound having the cage structure to the dielectric constant of a cured film which is the organic insulating film obtained by curing the drying film is ≥0.95 and ≤1.2. In the organic insulating film, the structure using the adamantane structure as the smallest unit is an adamantane structure, a polyamantane structure or a polyadamantane structure. COPYRIGHT: (C)2009,JPO&INPIT