METHOD OF INSPECTING TRANSPARENT SUBSTRATES

PROBLEM TO BE SOLVED: To provide an inspection method of a transparent substrate, wherein the unevenness of the thickness of a manufactured transparent substrate is easily confirmed. SOLUTION: A first transparent substrate having a known distribution of thickness and a second transparent substrate t...

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Bibliographische Detailangaben
Hauptverfasser: LAUENSTEIN CHRISTIAN, OZEKI MASAO, FERTIG WERNER
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide an inspection method of a transparent substrate, wherein the unevenness of the thickness of a manufactured transparent substrate is easily confirmed. SOLUTION: A first transparent substrate having a known distribution of thickness and a second transparent substrate to be inspected are prepared, and the difference of thickness in average between first and second transparent substrates is not more than 50 μm. A substrate gap of at least 0.1 mm is provided between the first substrate and the second substrate. Light whose half value width with respect to the peak luminance is at least 5 nm is radiated. The degree of distribution of thickness of the second transparent substrate is determined based on the interference intensity distribution of light passing through the first transparent substrate and the second transparent substrate. COPYRIGHT: (C)2009,JPO&INPIT