METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To reduce the chipping size, while suppressing clogging of a blade during dicing of a wafer. SOLUTION: When a wafer 34 is cut, the wafer is cut using a metal bond blade 31 which includes abrasive grains with a size which is not smaller than #3,000 and of which the tip portion i...

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Bibliographische Detailangaben
1. Verfasser: IZUMI TADAO
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Zusammenfassung:PROBLEM TO BE SOLVED: To reduce the chipping size, while suppressing clogging of a blade during dicing of a wafer. SOLUTION: When a wafer 34 is cut, the wafer is cut using a metal bond blade 31 which includes abrasive grains with a size which is not smaller than #3,000 and of which the tip portion is V-shaped so that a V-shaped shoulder portion enters in under the surface of the wafer 34 (at a depth of Z2from the surface of a substrate). This machining allows a cutting resistance to be increased to prevent the clogging of the blade. This allows, while the clogging of the blade is prevented, the chipping size can be suppressed to be small. COPYRIGHT: (C)2009,JPO&INPIT