FILM DEPOSITION METHOD, AND FILM DEPOSITION SYSTEM

PROBLEM TO BE SOLVED: To provide a film deposition method where the thickness distribution of a thin film deposited on a substrate can be improved without reducing a film deposition rate. SOLUTION: A main drum 6 autorotating around the axis Z1 is arranged almost in the vicinity of the center in a va...

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Bibliographische Detailangaben
Hauptverfasser: NAGAE MATASHIYU, SHIONO ICHIRO, KYO YUSHO
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a film deposition method where the thickness distribution of a thin film deposited on a substrate can be improved without reducing a film deposition rate. SOLUTION: A main drum 6 autorotating around the axis Z1 is arranged almost in the vicinity of the center in a vacuum tank, and a cylindrical reaction process zone 30 is arranged at a region in the vicinity of the center. A plurality of opening windows 66 are formed along the autorotating direction of the drum, and the reaction process zone 30 at the inside of the main drum 6 and a film deposition process zone 20 at the outside of the main drum are communicated through the opening windows 66. Four axes Z2 are formed at the almost equally divided positions along the surface of a circle concentric with the axis Z1, and subdrums 12 rotating around the respective axes Z2 are arranged. The outer circumference of each subdrum 12 is mounted with a substrate holder 14, and the substrate holders 14 are rotated as well synchronously with the autorotation of the subdrums 12. The rotating speed of the main drum 6 and the rotating speed of the subdrums 12 are respectively independently controlled. COPYRIGHT: (C)2009,JPO&INPIT