PIEZOELECTRIC DEVICE AND METHOD OF MANUFACTURING PIEZOELECTRIC DEVICE

PROBLEM TO BE SOLVED: To provide a method of manufacturing a piezoelectric device for hermetically sealing through holes by melting a sealing material of eutectic alloy. SOLUTION: The method of manufacturing a piezoelectric device is provided with steps of: preparing a base having a first connection...

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Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a method of manufacturing a piezoelectric device for hermetically sealing through holes by melting a sealing material of eutectic alloy. SOLUTION: The method of manufacturing a piezoelectric device is provided with steps of: preparing a base having a first connection electrode and a second connection electrode on a first surface and having a first through hole with a metal film to penetrate from the first connection electrode to a second surface opposite from a first surface, and a second through hole penetrating from the second connection electrode to the second surface; sealing the metal film of the first through hole and the second through hole with a sealing material that melts the metal film at 260°C or higher; mounting a piezoelectric vibrating reed having a first electrode pattern and a second electrode pattern on the first connection electrode and the second connection electrode of the base; and mounting a lid portion covering the piezoelectric vibrating reed and integrating the lid portion, the piezoelectric vibrating reed and the base. COPYRIGHT: (C)2009,JPO&INPIT