SUBSTRATE FOR THICK FILM TECHNOLOGY AND CIRCUIT BOARD

PROBLEM TO BE SOLVED: To provide a substrate for thick film technology in which an inorganic insulating substrate obtained by impregnating a basic material of glass with silicone resin is especially made available as a substrate for thick film technology, and to provide a circuit board. SOLUTION: In...

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Bibliographische Detailangaben
1. Verfasser:	MATSUMORA SATORU
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a substrate for thick film technology in which an inorganic insulating substrate obtained by impregnating a basic material of glass with silicone resin is especially made available as a substrate for thick film technology, and to provide a circuit board. SOLUTION: In the substrate for thick film technology, an undercoat film 3 containing 30-45 vol.% of polyetheretherketon resin powder and thermosetting resin is formed on an inorganic insulating substrate 2 obtained by impregnating a basic material of glass with silicone resin. Consequently, the undercoat film 3 can be formed on the inorganic insulating substrate 2 to exhibit good wettability and strong adhesion strength after curing. A patterned conductive coating 4 can be formed on the undercoat film 3 to exhibit good wettability and strong adhesion strength after curing by the thick film technology. COPYRIGHT: (C)2009,JPO&INPIT