FUNCTIONAL CONDUCTIVE COATING, ITS MANUFACTURING METHOD, AND PRINTED WIRING BOARD

PROBLEM TO BE SOLVED: To provide a low-temperature setting functional conductive coating high in adhesion with a resin board or copper foil, good in conductivity, and capable of soldering; to provide its manufacturing method and a printed wiring board. SOLUTION: The functional conductive coating con...

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Bibliographische Detailangaben
Hauptverfasser:	YANO KATSUMI, YOSHIDA SHINOBU, FUJISHIRO TOSHIFUMI, YOKOYAMA YOSHIYUKI, YAMAMICHI YUJI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS CONDUCTORS CORRECTING FLUIDS DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILLING PASTES INKS INSULATORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a low-temperature setting functional conductive coating high in adhesion with a resin board or copper foil, good in conductivity, and capable of soldering; to provide its manufacturing method and a printed wiring board. SOLUTION: The functional conductive coating contains 70-99 wt.% metallic powder comprising at least powder of Ag-coated Ni powder or Ag powder, and has thermosetting resin containing chelate modified epoxy resin. The chelate modified epoxy resin in the thermosetting resin is contained 10-20 wt.%, and formed by adding an unsaturated fatty acid. The printed wiring board has a conductive path formed by applying the functional conductive coating to an insulating board. COPYRIGHT: (C)2009,JPO&INPIT