NONFLAMMABLE RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD USING NONFLAMMABLE RESIN COMPOSITION, AND MANUFACTURING METHOD FOR NONFLAMMABLE RESIN COMPOSITION

PROBLEM TO BE SOLVED: To provide a nonflammable resin composition, which can be UV cured without deteriorating conventional physical properties, for a printed circuit board, a printed circuit board using it, and a manufacturing method for it. SOLUTION: This nonflammable resin composition comprises a...

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Bibliographische Detailangaben
Hauptverfasser:	OH JUN-ROK, CHO JAEOON, LEE SANG MOON, LEE KEUN YONG
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a nonflammable resin composition, which can be UV cured without deteriorating conventional physical properties, for a printed circuit board, a printed circuit board using it, and a manufacturing method for it. SOLUTION: This nonflammable resin composition comprises a composite epoxy resin, a photoacid generator, a hardening agent, a hardening accelerator and an inorganic filler. The composite epoxy resin includes a bisphenol A-type epoxy resin with an epoxy equivalent of 100-700, a cresol novolac type epoxy resin with an epoxy equivalent of 100-600, a rubber-modified type epoxy resin with an epoxy equivalent of 100-500, and a phosphorus type epoxy resin with an epoxy equivalent of 400-800. COPYRIGHT: (C)2009,JPO&INPIT