ELECTRICALLY CONDUCTIVE ADHESIVE MATERIAL

PROBLEM TO BE SOLVED: To provide an electrically conductive adhesive material lower in sintering temperature than conventional ones, capable of melting and sintering metallic particles therein by heat treatment with a short sintering time, giving high adhesion irrespective of substrate properties, and having low electrical resistance. SOLUTION: The electrically conductive adhesive material includes as a constituent thereof, such particles that the surfaces of metallic particles (e.g. silver particles) 4-40 nm in size are coated with an organic compound as an unsaturated bond-bearing amine 300 or lower in molecular weight are used. The particles can be obtained, for example, by reaction between a metal compound and the amine compound in a solvent. The CV value of the metallic particles is preferably 40% or less. Furthermore, it is preferable that the metallic component accounts for 50 mass% or greater of the adhesive material prior to drying. COPYRIGHT: (C)2009,JPO&INPIT