METHOD OF MANUFACTURING POLYIMIDE FILM

PROBLEM TO BE SOLVED: To provide a continuous manufacturing method of a polyimide film in which it is controlled so that the coefficient of linear expansion of a width direction is smaller than the coefficient of linear expansion of a length direction. SOLUTION: The method of manufacturing the polyi...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	UEKIDO TAKESHI, IIIZUMI NOBORU, MASUI EIJI, NISHINO TOSHIYUKI, YANAGIDA KEIICHI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL WORKING-UP
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a continuous manufacturing method of a polyimide film in which it is controlled so that the coefficient of linear expansion of a width direction is smaller than the coefficient of linear expansion of a length direction. SOLUTION: The method of manufacturing the polyimide film is characterized by casting the solvent/solution of a polyimide precursor on a support, removing the solvent in the solution and peeling it from the support as a self-sustaining film, stretching the self-sustaining film in a width direction at an initial heating temperature range of 80-300°C, and thereafter heating at the last heating temperature of 350-580°C. COPYRIGHT: (C)2009,JPO&INPIT