LASER CUTTING APPARATUS AND METHOD
PROBLEM TO BE SOLVED: To provide a laser cutting apparatus and a method therefor for cutting a two glasses-attached panel for a liquid crystal display panel using a laser beam. SOLUTION: A laser cutting apparatus comprises: a first laser unit for irradiating a first laser beam with a first wavelengt...
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creator | JEONG SEONG-WOOK KIN HEIITSU CHU DAE-HO RI GUSHOKU KIM BOM-SU |
description | PROBLEM TO BE SOLVED: To provide a laser cutting apparatus and a method therefor for cutting a two glasses-attached panel for a liquid crystal display panel using a laser beam. SOLUTION: A laser cutting apparatus comprises: a first laser unit for irradiating a first laser beam with a first wavelength along a marked cutting line of an object to be cut; a means for cooling the marked cutting line to which the first laser beam has been irradiated, and thereby generating crack at the cooled cutting line; a second laser unit for irradiating a second laser beam with a second wavelength onto the crack of the marked cutting line; a means for sensing the second laser beam reflected by the crack; and a control means for outputting a signal for correcting a traveling path of the first laser beam by comparing a real cutting line obtained by the sensed signal of the sensing means with the marked cutting line and determining whether the real cutting line deviates from the marked cutting line. COPYRIGHT: (C)2009,JPO&INPIT |
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SOLUTION: A laser cutting apparatus comprises: a first laser unit for irradiating a first laser beam with a first wavelength along a marked cutting line of an object to be cut; a means for cooling the marked cutting line to which the first laser beam has been irradiated, and thereby generating crack at the cooled cutting line; a second laser unit for irradiating a second laser beam with a second wavelength onto the crack of the marked cutting line; a means for sensing the second laser beam reflected by the crack; and a control means for outputting a signal for correcting a traveling path of the first laser beam by comparing a real cutting line obtained by the sensed signal of the sensing means with the marked cutting line and determining whether the real cutting line deviates from the marked cutting line. 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SOLUTION: A laser cutting apparatus comprises: a first laser unit for irradiating a first laser beam with a first wavelength along a marked cutting line of an object to be cut; a means for cooling the marked cutting line to which the first laser beam has been irradiated, and thereby generating crack at the cooled cutting line; a second laser unit for irradiating a second laser beam with a second wavelength onto the crack of the marked cutting line; a means for sensing the second laser beam reflected by the crack; and a control means for outputting a signal for correcting a traveling path of the first laser beam by comparing a real cutting line obtained by the sensed signal of the sensing means with the marked cutting line and determining whether the real cutting line deviates from the marked cutting line. 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KIN HEIITSU ; CHU DAE-HO ; RI GUSHOKU ; KIM BOM-SU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2009066664A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2009</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FREQUENCY-CHANGING</topic><topic>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</topic><topic>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</topic><topic>GLASS</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>MACHINE TOOLS</topic><topic>MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>METALLURGY</topic><topic>MINERAL OR SLAG WOOL</topic><topic>NON-LINEAR OPTICS</topic><topic>OPTICAL ANALOGUE/DIGITAL CONVERTERS</topic><topic>OPTICAL LOGIC ELEMENTS</topic><topic>OPTICS</topic><topic>PERFORMING OPERATIONS</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</topic><topic>TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF</topic><topic>TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><topic>WORKING CEMENT, CLAY, OR STONE</topic><topic>WORKING STONE OR STONE-LIKE MATERIALS</topic><toplevel>online_resources</toplevel><creatorcontrib>JEONG SEONG-WOOK</creatorcontrib><creatorcontrib>KIN HEIITSU</creatorcontrib><creatorcontrib>CHU DAE-HO</creatorcontrib><creatorcontrib>RI GUSHOKU</creatorcontrib><creatorcontrib>KIM BOM-SU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>JEONG SEONG-WOOK</au><au>KIN HEIITSU</au><au>CHU DAE-HO</au><au>RI GUSHOKU</au><au>KIM BOM-SU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>LASER CUTTING APPARATUS AND METHOD</title><date>2009-04-02</date><risdate>2009</risdate><abstract>PROBLEM TO BE SOLVED: To provide a laser cutting apparatus and a method therefor for cutting a two glasses-attached panel for a liquid crystal display panel using a laser beam. SOLUTION: A laser cutting apparatus comprises: a first laser unit for irradiating a first laser beam with a first wavelength along a marked cutting line of an object to be cut; a means for cooling the marked cutting line to which the first laser beam has been irradiated, and thereby generating crack at the cooled cutting line; a second laser unit for irradiating a second laser beam with a second wavelength onto the crack of the marked cutting line; a means for sensing the second laser beam reflected by the crack; and a control means for outputting a signal for correcting a traveling path of the first laser beam by comparing a real cutting line obtained by the sensed signal of the sensing means with the marked cutting line and determining whether the real cutting line deviates from the marked cutting line. COPYRIGHT: (C)2009,JPO&INPIT</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FREQUENCY-CHANGING GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GLASS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACHINE TOOLS MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY MINERAL OR SLAG WOOL NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PERFORMING OPERATIONS PHYSICS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE TRANSPORTING WELDING WORKING BY LASER BEAM WORKING CEMENT, CLAY, OR STONE WORKING STONE OR STONE-LIKE MATERIALS |
title | LASER CUTTING APPARATUS AND METHOD |
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