LASER CUTTING APPARATUS AND METHOD

PROBLEM TO BE SOLVED: To provide a laser cutting apparatus and a method therefor for cutting a two glasses-attached panel for a liquid crystal display panel using a laser beam. SOLUTION: A laser cutting apparatus comprises: a first laser unit for irradiating a first laser beam with a first wavelengt...

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Bibliographische Detailangaben
Hauptverfasser: JEONG SEONG-WOOK, KIN HEIITSU, CHU DAE-HO, RI GUSHOKU, KIM BOM-SU
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a laser cutting apparatus and a method therefor for cutting a two glasses-attached panel for a liquid crystal display panel using a laser beam. SOLUTION: A laser cutting apparatus comprises: a first laser unit for irradiating a first laser beam with a first wavelength along a marked cutting line of an object to be cut; a means for cooling the marked cutting line to which the first laser beam has been irradiated, and thereby generating crack at the cooled cutting line; a second laser unit for irradiating a second laser beam with a second wavelength onto the crack of the marked cutting line; a means for sensing the second laser beam reflected by the crack; and a control means for outputting a signal for correcting a traveling path of the first laser beam by comparing a real cutting line obtained by the sensed signal of the sensing means with the marked cutting line and determining whether the real cutting line deviates from the marked cutting line. COPYRIGHT: (C)2009,JPO&INPIT