MANUFACTURING METHOD OF PROBE CONTACT

PROBLEM TO BE SOLVED: To enable highly accurate and simple control of a break position, when a probe contact portion on a substrate end part is broken and removed. SOLUTION: The substrate end part 11b is removed from the substrate 11a that breaks the substrate 11a brittle along a slit 17, by pressin...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: WAKABAYASHI YOSHINORI, SUZUKI TAKESHI, UJIIE AKIRA
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To enable highly accurate and simple control of a break position, when a probe contact portion on a substrate end part is broken and removed. SOLUTION: The substrate end part 11b is removed from the substrate 11a that breaks the substrate 11a brittle along a slit 17, by pressing the surface of the substrate end part 11b with a depressing member 18. The break position of the breaking is controlled so as to merge a break position 19, located on the extension of the stress concentration end 16a of two breaking control structures 16. The breaking control structures 16 are arranged on the surface of the substrate 11a, with high positioning accuracy through the alignment method of photolithography. Thus, an elastic contact piece constituted of a tip 14a, projecting from the break position 19, which serves as an edge of the substrate 11a, is formed in a stable and high-accuracy manner. COPYRIGHT: (C)2009,JPO&INPIT