MAGNETOMETRIC SENSOR PACKAGE

PROBLEM TO BE SOLVED: To provide a magnetometric sensor package that, while securing arrangement flexibility of a magnetometric sensor, moreover, does not influence earth's magnetism. SOLUTION: An IC 12, an X-axis magnetometric sensor 13a, a Y-axis magnetometric sensor 13b and a Z-axis magnetometric sensor 13c are mounted on one main surface of a substrate 11. An electrode pad is formed on the substrate 11, the IC 12 and magnetometric sensors 13a-13c, respectively. Wire bonding is applied by a wire 14 between the substrate 11 and the IC 12, and between the IC 12 and the magnetometric sensors 13a-13c. Packaging is applied by a package material 15 to one main surface side of the substrate 11. The electrode pad on the substrate 11 is electrically connected to the electrode pad 16, on the other main surface side of the substrate 11. The electrode pad 16 is constituted, by laminating a Cu layer 16a, a PD-P plated layer 16b which is a nonmagnetic diffusion preventing layer, and an Au layer 16c, in this order, on the other main surface of the substrate 11. COPYRIGHT: (C)2009,JPO&INPIT