POLYIMIDE METAL LAMINATED PLATE

PROBLEM TO BE SOLVED: To provide a polyimide metal laminated plate in which troubles such as the displacement of in wiring, an edge short circuit, the sink of the metal wiring into a polyimide layer, and a trouble such as the peel-off of the wiring from the polyimide layer do not occur. SOLUTION: This polyimide metal laminated plate is composed of the polyimide layer and a metal layer. At least one layer of the polyimide layer is a polyimide (PI) layer having an elastic modulus in a range from 1 to 30 GPa in a temperature zone of 350°C or higher. The polyimide (PI) layer is formed by synthesizing diamine and a tetrapod carboxylic acid dianhydride, wherein 70 mol% or more of the whole of the diamine component which becomes a raw material is one kind or more of compounds selected from o-phenylenediamine or the like, 90 mol% or more of the whole of the tetrapod carboxylic acid dianhydride is one kind or more of compounds selected from a pyromellitic acid dianhydride or the like. COPYRIGHT: (C)2009,JPO&INPIT