BACKING MATERIAL, ULTRASONIC PROBE, ULTRASONIC ENDOSCOPE, ULTRASONIC DIAGNOSTIC DEVICE, AND ULTRASONIC ENDOSCOPE DEVICE

PROBLEM TO BE SOLVED: To provide a backing material capable of suppressing increase of a surface temperature of an ultrasonic probe. SOLUTION: This backing material is arranged on a back surface of at least one oscillator for transmitting and/or receiving ultrasonic waves in an ultrasonic probe. The...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	HIUGA HIROAKI
Format:	Patent
Sprache:	eng
Schlagworte:	DEAF-AID SETS DIAGNOSIS ELECTRIC COMMUNICATION TECHNIQUE ELECTRICITY HUMAN NECESSITIES HYGIENE IDENTIFICATION LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS MEDICAL OR VETERINARY SCIENCE PUBLIC ADDRESS SYSTEMS SURGERY
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a backing material capable of suppressing increase of a surface temperature of an ultrasonic probe. SOLUTION: This backing material is arranged on a back surface of at least one oscillator for transmitting and/or receiving ultrasonic waves in an ultrasonic probe. The backing material is provided with: a backing base material containing a polymer material; and a heat-conducting fiber arranged in the backing base material, having heat conductivity larger than that of the backing base material, and continuously penetrating the backing material from its first surface contacting at least one oscillator to its second surface different from the first surface. COPYRIGHT: (C)2009,JPO&INPIT