SUBSTRATE PROCESSING METHOD

PROBLEM TO BE SOLVED: To provide a substrate processing method in which the inside of a substrate surface of a circular disk is uniformly washed in a washing treatment by mixing and discharging a compressed gas and a treating chemical. SOLUTION: Particles on the substrate can be removed through a treatment wherein mist is discharged to the pattern-formed substrate using a two-fluid nozzle mixing the compressed gas and chemical to produce the mist. A substrate radius vector component vrof a two-fluid nozzle moving speed (v) is set in inverse proportion to the distance (r) from the substrate center and then variance in washing scan time per unit area in the substrate surface is reduced in the substrate treatment to reduce washing variance. COPYRIGHT: (C)2009,JPO&INPIT