METHOD OF ELIMINATING FOREIGN MATERIAL

PROBLEM TO BE SOLVED: To provide a method of eliminating foreign materials capable of efficiently eliminating large chips, chips adhered in the state of sticking a protection film, and furthermore, foreign materials adhered to the protection film by static electricity. SOLUTION: This is a method of...

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Bibliographische Detailangaben
1. Verfasser:	TERAKAWA TETSUYA
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CLEANING CLEANING IN GENERAL CONVEYING HANDLING THIN OR FILAMENTARY MATERIAL HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS,CABLES PACKING PERFORMING OPERATIONS PREVENTION OF FOULING IN GENERAL SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS STORING TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method of eliminating foreign materials capable of efficiently eliminating large chips, chips adhered in the state of sticking a protection film, and furthermore, foreign materials adhered to the protection film by static electricity. SOLUTION: This is a method of eliminating foreign materials adhered to an outer surface of a protection film of a plastic sheet conveyed, and coated with the protection film on the surface thereof. An adhesive roller A is brought in contact with an outer surface of the protection film of the plastic sheet coated with the protection film on the surface thereof so that the foreign materials adhered to the outer surface of the protection film are adhered to the adhesive roller A. Continuously, an adhesive roller B having adhesiveness higher than that of the adhesive roller A is brought in contact with the adhesive roller A, so that the foreign material is adhered to the adhesive roller B. COPYRIGHT: (C)2009,JPO&INPIT