RESIN-ENCAPSULATED MOLDING METHOD OF ELECTRONIC COMPONENT AND MOLDING DIE

PROBLEM TO BE SOLVED: To efficiently remove resin tailings falling from a bottom mold pot and efficiently upgrade productivity of a finished product (a resin molding) through resin-encapsulated molding process within upper/lower cavities, in a molding die (top/bottom molds) for resin-encapsulated mo...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HAMADA NAOKI, IJIRI KAZUHIRO, YAMADA SHINYA
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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