RESIN-ENCAPSULATED MOLDING METHOD OF ELECTRONIC COMPONENT AND MOLDING DIE

PROBLEM TO BE SOLVED: To efficiently remove resin tailings falling from a bottom mold pot and efficiently upgrade productivity of a finished product (a resin molding) through resin-encapsulated molding process within upper/lower cavities, in a molding die (top/bottom molds) for resin-encapsulated molding of electronic components. SOLUTION: This molding die for resin-encapsulated molding is configured of a container 20 for receiving resin tailings, which is arranged slidably at a plunger 5, elastically supported by a compression spring 26 in the pot 4 direction, and a pot 4 whose lower opening 4a is arranged within the range of an opening 20a of the container 20 at least, on the same level. Accordingly, first, the plunger 5 is pressed and then, the opening 20a of the container 20 is elastically pressed to the top surface 21a of a pressing part (a recessed part) 21 arranged on the lower side of an insertion hole 19 in a lower adapter plate 16 connected communicating with the pot 4. Next, the resin material 13 melted by heat inside the pot 4 is packed by injection inside cavities 6 and 9 for resin molding, in such a state that the container 20 is elastically pressed. COPYRIGHT: (C)2009,JPO&INPIT