ELECTROSTATIC CHUCK

ELECTROSTATIC CHUCK

PROBLEM TO BE SOLVED: To provide an electrostatic chuck with a heater offering sufficient temperature-increasing speed to enable efficient wafer processing. SOLUTION: The electrostatic chuck includes a base 10, a heat-insulating layer 12 stuck to the upper side of the base 10, and a chuck function p...

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Hauptverfasser: YOSHIKAWA TADAYOSHI, YONEKURA HIROSHI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GENERATION
SEMICONDUCTOR DEVICES
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creator YOSHIKAWA TADAYOSHI
YONEKURA HIROSHI
description PROBLEM TO BE SOLVED: To provide an electrostatic chuck with a heater offering sufficient temperature-increasing speed to enable efficient wafer processing. SOLUTION: The electrostatic chuck includes a base 10, a heat-insulating layer 12 stuck to the upper side of the base 10, and a chuck function portion 20 stuck to the upper side of the heat-insulating layer 12, the chuck function portion 20 being made by incorporating a heater electrode 24 and an ESC electrode 26 in a ceramic board 22. Adhesive layers 14 are formed on both surfaces of the heat-insulating layer 12. When the base 10 is stuck to the chuck function portion 20 at high adhesive strength, an opening 12a is formed in the heat-insulating layer 12 and is filled with the adhesive layer 14. COPYRIGHT: (C)2009,JPO&INPIT
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subjects BASIC ELECTRIC ELEMENTS
CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GENERATION
SEMICONDUCTOR DEVICES
title ELECTROSTATIC CHUCK
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