ELECTROSTATIC CHUCK

PROBLEM TO BE SOLVED: To provide an electrostatic chuck with a heater offering sufficient temperature-increasing speed to enable efficient wafer processing. SOLUTION: The electrostatic chuck includes a base 10, a heat-insulating layer 12 stuck to the upper side of the base 10, and a chuck function p...

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Bibliographische Detailangaben
Hauptverfasser:	YOSHIKAWA TADAYOSHI, YONEKURA HIROSHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERATION SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an electrostatic chuck with a heater offering sufficient temperature-increasing speed to enable efficient wafer processing. SOLUTION: The electrostatic chuck includes a base 10, a heat-insulating layer 12 stuck to the upper side of the base 10, and a chuck function portion 20 stuck to the upper side of the heat-insulating layer 12, the chuck function portion 20 being made by incorporating a heater electrode 24 and an ESC electrode 26 in a ceramic board 22. Adhesive layers 14 are formed on both surfaces of the heat-insulating layer 12. When the base 10 is stuck to the chuck function portion 20 at high adhesive strength, an opening 12a is formed in the heat-insulating layer 12 and is filled with the adhesive layer 14. COPYRIGHT: (C)2009,JPO&INPIT