ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

PROBLEM TO BE SOLVED: To provide an electronic component which is formed by mounting an electronic component chip on a ceramic multilayer board using bumps and assures the excellent credibility of electrical connection by a plurality of bumps. SOLUTION: Disclosed is the electronic component 1 which...

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Bibliographische Detailangaben
Hauptverfasser:	KITA RYOICHI, SAKAI TAKUMI, HIRA MITSUYOSHI, YAMATO HIDEJI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an electronic component which is formed by mounting an electronic component chip on a ceramic multilayer board using bumps and assures the excellent credibility of electrical connection by a plurality of bumps. SOLUTION: Disclosed is the electronic component 1 which has the electronic component chip 3 with the plurality of bumps 14 to 16 mounted on a top surface 2a of the ceramic multilayer substrate 2 and also has a first electrode land 11, a second electrode land 12, and a first electrode land 13, where the bumps 14 to 16 are connected, in order on the ceramic multilayer substrate 2, the top surface 2a of the ceramic multilayer substrate 2 being made convex so that the height of the second electrode land 12 is larger than the height of the first electrode lands 11 and 13. COPYRIGHT: (C)2009,JPO&INPIT