RECYCLING METHOD OF POLISHING SLURRY

PROBLEM TO BE SOLVED: To provide a recycling method of polishing slurry capable of recycling used slurry used in a semiconductor wafer polishing process, in particular, a final polishing process, and of reducing manufacturing cost of a semiconductor wafer by remarkably reducing slurry usage. SOLUTIO...

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Bibliographische Detailangaben
Hauptverfasser:	KOSASA KAZUAKI, GOTO ISAMU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a recycling method of polishing slurry capable of recycling used slurry used in a semiconductor wafer polishing process, in particular, a final polishing process, and of reducing manufacturing cost of a semiconductor wafer by remarkably reducing slurry usage. SOLUTION: This recycling method of polishing slurry used for recycling used slurry prepared by including colloidal silica, and used in the polishing process of a semiconductor wafer is characterized by executing: a process S7 of adding a dispersant in recovered used slurry to prevent gelation of the used slurry; a process S8 of irradiating the used slurry with the dispersant added therein with ultrasonic waves to disperse the gelated slurry and aggregated silica; and a process S9 of removing a foreign substance in the used slurry after ultrasonic wave irradiation by a filter. COPYRIGHT: (C)2009,JPO&INPIT