THERMAL FUSE

PROBLEM TO BE SOLVED: To provide a thermal fuse that can be more downsized. SOLUTION: The thermal fuse is provided with a first metal terminal 11 as well as a second metal terminal 12, a first insulating film 13 with respective one end parts 11a, 12a of the first metal terminal 11 and the second met...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: WATANABE TAKESHI, ISAKI MASATOSHI, SENDA KENJI
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a thermal fuse that can be more downsized. SOLUTION: The thermal fuse is provided with a first metal terminal 11 as well as a second metal terminal 12, a first insulating film 13 with respective one end parts 11a, 12a of the first metal terminal 11 and the second metal terminal 12 arranged, a soluble alloy 14 fitted between the one end part 11a of the first metal terminal 11 and the one end part 12a of the second metal terminal 12, and a second insulating film 15 arranged so as to cover the soluble alloy 14 and firmly fixed to the first insulating film 13. The other end part 11b of the first metal terminal 11 is bent upward, a part of which is positioned above the second insulating film 15, and the other end part 12b of the second metal terminal 12 is bent downward, a part of which is positioned below the first insulating film 13. COPYRIGHT: (C)2009,JPO&INPIT