SEMICONDUCTOR STRAIN SENSOR, AND MOUNTING METHOD OF SEMICONDUCTOR STRAIN SENSOR

PROBLEM TO BE SOLVED: To suppress a change of a sensor characteristic caused by temperature rise or thermal deformation by improving heat radiation from a sensor chip, in a semiconductor strain sensor using a semiconductor strain gage. SOLUTION: In this semiconductor strain sensor having a strain sensor chip wherein a piezo resistance element is formed on a semiconductor, a metallic base plate, and a wiring part for leading out wiring from an electrode of the sensor chip to the outside, the sensor chip is bonded to the base plate with a metal material, and connection areas to be connected to a measuring object are provided on at least two spots sandwiching a bonding part of the sensor chip on the base plate. Since the sensor chip is bonded to the metallic base plate with the metal material, heat generated in the sensor chip easily escapes from the sensor chip rear surface to the base plate, to thereby prevent thermal deformation caused by temperature rise of the sensor chip and temperature unevenness between the sensor chip and the base plate. COPYRIGHT: (C)2009,JPO&INPIT