CAPACITOR-EMBEDDED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

PROBLEM TO BE SOLVED: To provide a capacitor-embedded printed circuit board that can minimize deviations in contact area between a second electrode and a dielectric layer, so that ultimately, errors in capacitance may be reduced; and to provide a method thereof. SOLUTION: The capacitor-embedded prin...

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Bibliographische Detailangaben
Hauptverfasser:	KIM HONG-WON, YI SUNG, KEN NEIDO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a capacitor-embedded printed circuit board that can minimize deviations in contact area between a second electrode and a dielectric layer, so that ultimately, errors in capacitance may be reduced; and to provide a method thereof. SOLUTION: The capacitor-embedded printed circuit board includes: an insulating layer, a first electrode formed on one side of the insulating layer, a second electrode formed on one side of the first electrode, a dielectric layer formed on one side of the second electrode, and a third electrode formed on one side of the dielectric layer, and is characterized in that the electrodes of the capacitor are formed in a dual structure having the second electrode formed on the one side of the first electrode. COPYRIGHT: (C)2009,JPO&INPIT