COATING PROCESSOR, AND COATING PROCESSING METHOD

PROBLEM TO BE SOLVED: To provide a coating processor capable of forming a coating film excelling in film thickness uniformity on the whole surface of a substrate with a simple structure and a small quantity of coating liquid. SOLUTION: The coating processor is a device which forms a coating film by...

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Bibliographische Detailangaben
Hauptverfasser:	TOCHISHITA SHOJI, ITO YOSHIHITO, KAJIWARA KATSUHIRO, YANO KIYOSHI, OTOMO MINORU, TSUTANI HITOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SEMICONDUCTOR DEVICES SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a coating processor capable of forming a coating film excelling in film thickness uniformity on the whole surface of a substrate with a simple structure and a small quantity of coating liquid. SOLUTION: The coating processor is a device which forms a coating film by expanding a coating liquid on a substrate over the whole surface of the substrate by rotating the substrate, and includes: a first coating liquid discharge means of discharging, to a rotational center position of the substrate, a low-viscosity coating liquid being a solution having the same chemical constituent as that of a solution forming the coating film, and high in wettability to a surface of the substrate; a second coating liquid discharge means of discharging, to the rotational center position, a high-viscosity coating liquid being a solution for forming the coating film, and having viscosity higher than that of the low-viscosity coating liquid after the low-viscosity coating liquid is discharged by the first coating liquid discharge means; and a substrate rotating means of fixing the substrate at the rotating center position to rotate the substrate at a predetermined rotating speed. COPYRIGHT: (C)2009,JPO&INPIT