MEASURING METHOD, MEASURING APPARATUS, AND PROGRAM

PROBLEM TO BE SOLVED: To provide a measuring method, a measuring apparatus, and a program which can measure the shape of a carrier tape having a recessed portion for accommodating an electronic component with high precision. SOLUTION: The measuring method measures the shape of a carrier tape in whic...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: NAKAGAWA SEISHI
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a measuring method, a measuring apparatus, and a program which can measure the shape of a carrier tape having a recessed portion for accommodating an electronic component with high precision. SOLUTION: The measuring method measures the shape of a carrier tape in which a recessed portion for accommodating an electronic component is formed. The method comprises setting a measurement area in the carrier tape (step S2), irradiating a plurality of measurement points within the measurement area with laser light and acquiring three-dimensional coordinate information at the plurality of measurement points (step S6), setting a virtual surface (step S12), and generating the cross-sectional-shape information of the carrier tape on the virtual surface on the basis of the coordinate information (step S13). COPYRIGHT: (C)2009,JPO&INPIT