DEPOSITION METHOD AND APPARATUS BY MICROPLASMA

PROBLEM TO BE SOLVED: To provide a deposition method and an apparatus by microplasma where the size of microplasma is made small as possible, the heat capacity thereof is reduced, so as to prevent the damage of a substrate upon plasma jet irradiation, further, a metal or the like is melted and evaporated or vaporized, so as to be jetted together with a plasma jet, thus the dots and lines of the metal or the like with a fine size are formed on the substrate. SOLUTION: Disclosed is a low melting point substrate with fine dots obtained by depositing a material melted and evaporated or vaporized by microplasma on a low melting point substrate, so as to be a dot shape, and in which the diameter of the dots is 1 to 100 μm. Also disclosed is a deposition method by microplasma for forming dots or lines at microregions on a substrate where a material for being deposited and a plasma gas are introduced into a quartz tube, further, an induction coil is arranged at the outer circumference of the quartz tube, thus high frequency waves are applied to the induction coil, and the material is melted and evaporated or vaporized, so as to be jetted from the tip of the capillary of the quartz tube having an inside diameter of ≤100 μm toward the substrate. COPYRIGHT: (C)2009,JPO&INPIT