ELECTRONIC COMPONENT MOUNTING DEVICE AND MOUNTING METHOD OF THE SAME

PROBLEM TO BE SOLVED: To provide a mounting device capable of preventing the misregistration of TCPs due to tension occurred in a sheet member, when the TCPs are press-bonded to a circuit substrate through the sheet member. SOLUTION: This electronic component mounting device comprises a plurality of...

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1. Verfasser: TOGASHI TOKUKAZU
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a mounting device capable of preventing the misregistration of TCPs due to tension occurred in a sheet member, when the TCPs are press-bonded to a circuit substrate through the sheet member. SOLUTION: This electronic component mounting device comprises a plurality of pressing tools 5a-5c that are driven toward a lower direction and press-bonds the other ends of a plurality of TCPs 4 to a terminal of a circuit substrate 3, where the terminal having mounting components 6 and adhesive tape 2 sticked on its side boarder portion is arranged, through the adhesive tape by heating; a sheet member 9 staying between the connecting portion of the circuit substrate and the TCP and the pressing tools to prevent the attachment of the molten adhesive tape to the pressing tools, when the other ends of the TCPs are press-bonded to the terminal of the circuit substrate 3 by the plurality of pressing tools; and a control unit that performs the press-bonding by the plurality of pressing tools at different timings, when the other ends of the TCPs are press-bonded to the terminal of the circuit substrate by the plurality of pressing tools through the sheet member. COPYRIGHT: (C)2009,JPO&INPIT