INDIRECT QUALITY EVALUATION METHOD FOR GETTERING LAYER FORMED ON WAFER BACKSIDE

PROBLEM TO BE SOLVED: To provide an indirect evaluation method by which the quality of a gettering layer formed on a backside of a wafer can be more easily and correctly confirmed compared to the conventional method. SOLUTION: The indirect quality evaluation method for a gettering layer has a sandbl...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	MIYAZAKI MORIMASA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!