IMAGE DISPLAY DEVICE AND ITS MANUFACTURING METHOD
PROBLEM TO BE SOLVED: To take countermeasures to a failure of a photo process due to an exhaust hole formed in a cathode substrate in an FED (field emission display). SOLUTION: Only a hole 101 is formed on an exhaust hole 10 formed on a cathode substrate 1 while a cathode substrate 1 is going throug...
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Zusammenfassung: | PROBLEM TO BE SOLVED: To take countermeasures to a failure of a photo process due to an exhaust hole formed in a cathode substrate in an FED (field emission display). SOLUTION: Only a hole 101 is formed on an exhaust hole 10 formed on a cathode substrate 1 while a cathode substrate 1 is going through a photo process. Furthermore, 103 is a chamfering. Therefore, the side on which a film is formed on the cathode substrate 1 is flat during the photo process. After the all photo process is completed, a hole 102 is formed and the exhaust hole 10 is made a through hole. By this structure, various kinds of failures due to a resist staying in the exhaust hole 10 at the photo process is prevented. Since a residue or the like of a metallic film is not formed in the vicinity of the exhaust hole 10, voltage withstanding of the display device is improved. COPYRIGHT: (C)2009,JPO&INPIT |
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