THREE-DIMENSIONAL PRINTED CIRCUIT BOARD, AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a package mode which is indispensable for actualizing down-sizing, small thickness, light weight, high definition, multifunction or the like for mobile devices and by which compact, low height and three-dimensional mounting corresponding to multifunction and multi pi...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	NAKAMURA SADASHI, ECHIGO FUMIO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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