THREE-DIMENSIONAL PRINTED CIRCUIT BOARD, AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a package mode which is indispensable for actualizing down-sizing, small thickness, light weight, high definition, multifunction or the like for mobile devices and by which compact, low height and three-dimensional mounting corresponding to multifunction and multi pi...

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Bibliographische Detailangaben
Hauptverfasser:	NAKAMURA SADASHI, ECHIGO FUMIO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a package mode which is indispensable for actualizing down-sizing, small thickness, light weight, high definition, multifunction or the like for mobile devices and by which compact, low height and three-dimensional mounting corresponding to multifunction and multi pin of semiconductors can be easily actualized. SOLUTION: The three-dimensional printed circuit board 15 is provided with an upper substrate 1, a lower substrate 2 and a connecting layer 3 connecting these substrates. The upper and lower substrates 1 and 2 have different shapes, respectively, to form a concave 4, and the connecting layer 3 is made of an insulating material containing resin and a through hole is formed at a specified position of the connecting layer 3. A via 7, where the through hole is filled with a conductive paste 6, is provided, and a metal film 14 is formed to cover an opening wherein the concave 4 is formed in the upper substrate 1. COPYRIGHT: (C)2009,JPO&INPIT