ELECTRONIC COMPONENT

ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To obtain an electronic component which suppresses the large growth of a whisker 15 from a plating layer 13 formed on the surface of a base material while employing a Pb-free plating material. SOLUTION: The plating layer 13 is formed of the Pb-free plating material on the surfa...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: SHIBATA YASUFUMI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To obtain an electronic component which suppresses the large growth of a whisker 15 from a plating layer 13 formed on the surface of a base material while employing a Pb-free plating material. SOLUTION: The plating layer 13 is formed of the Pb-free plating material on the surface of the base material as a terminal 12. The surface is coated with a resin coating layer 14 for moisture proofing. At this time, the spring hardness of the resin coating layer 14 is 80 to 85°. COPYRIGHT: (C)2009,JPO&INPIT