ADHESIVE COMPOSITION FOR FORMALDEHYDE RESIN-BASED LIGNEOUS MATERIAL

PROBLEM TO BE SOLVED: To provide an adhesive composition for a formaldehyde resin ligneous material obtaining stable adhesive performance though an adhesion curing time is short, sufficiently reducing diffusion of formaldehyde, and reducing variation in viscosity. SOLUTION: This adhesive composition...

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Hauptverfasser: ITO HISAYA, IWASAKI MASAHARU, MURATA YUJI, HASEGAWA HISASHI, NEGISHI SHIGEO, UEDA SEIJI, FUJII ICHIRO, TSUCHIYA KATSUHISA, IIJIMA NOBURO
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide an adhesive composition for a formaldehyde resin ligneous material obtaining stable adhesive performance though an adhesion curing time is short, sufficiently reducing diffusion of formaldehyde, and reducing variation in viscosity. SOLUTION: This adhesive composition includes an aqueous solution of formaldehyde resin, and a formaldehyde capture agent composed of an acid ammonium salt coated with a higher fatty acid reactive with formaldehyde. The formaldehyde resin is a resin obtained by condensation of formaldehyde and an amino compound. The formaldehyde capture agent is obtained by coating acid ammonium salt with higher fatty acid of a range of 0.5-30 wt.% to the total amount. The higher fatty acid has a melting point within a range of 40-120°C. The formaldehyde capture agent of 0.5-15 pts.wt. is included to solid content of the aqueous solution of the formaldehyde of 100 pts.wt. The higher fatty acid is reacted with formaldehyde at a temperature of 110-200°C. COPYRIGHT: (C)2009,JPO&INPIT