MANUFACTURING METHOD AND FORMATION SUBSTRATE OF THIN-FILM DEVICE, AND MANUFACTURING METHOD OF LIQUID INJECTION HEAD

PROBLEM TO BE SOLVED: To provide a manufacturing method of a thin-film device and a formation substrate of a thin-film device for improving formation precision in a thin-film element, and to provide a manufacturing method of a liquid injection head. SOLUTION: The manufacturing method of a thin-film...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: SHIMADA KATSUTO
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a manufacturing method of a thin-film device and a formation substrate of a thin-film device for improving formation precision in a thin-film element, and to provide a manufacturing method of a liquid injection head. SOLUTION: The manufacturing method of a thin-film device, where a thin-film element is provided on a device substrate, includes a process for forming an element formation film for composing a thin-film element on a wafer for devices in which a plurality device substrates are formed integrally and for forming the thin-film element by patterning the element formation film, and a process for dividing the wafer for devices into the plurality of device substrates. The process for forming the thin-film element includes a process for forming a thin-film section where one portion of the element formation film is not formed at a prescribed position between the device substrates in the wafer for devices before patterning the element formation film. COPYRIGHT: (C)2009,JPO&INPIT