MANUFACTURING METHOD AND FORMATION SUBSTRATE OF THIN-FILM DEVICE, AND MANUFACTURING METHOD OF LIQUID INJECTION HEAD
PROBLEM TO BE SOLVED: To provide a manufacturing method of a thin-film device and a formation substrate of a thin-film device for improving formation precision in a thin-film element, and to provide a manufacturing method of a liquid injection head. SOLUTION: The manufacturing method of a thin-film...
Gespeichert in:
1. Verfasser: | |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a manufacturing method of a thin-film device and a formation substrate of a thin-film device for improving formation precision in a thin-film element, and to provide a manufacturing method of a liquid injection head. SOLUTION: The manufacturing method of a thin-film device, where a thin-film element is provided on a device substrate, includes a process for forming an element formation film for composing a thin-film element on a wafer for devices in which a plurality device substrates are formed integrally and for forming the thin-film element by patterning the element formation film, and a process for dividing the wafer for devices into the plurality of device substrates. The process for forming the thin-film element includes a process for forming a thin-film section where one portion of the element formation film is not formed at a prescribed position between the device substrates in the wafer for devices before patterning the element formation film. COPYRIGHT: (C)2009,JPO&INPIT |
---|