DIE BONDER AND DIE BONDING METHOD

PROBLEM TO BE SOLVED: To provide a die bonder and a die bonding method capable of executing highly precise die bonding without being influenced by thermal deformation. SOLUTION: A detecting means 42 detects the three-dimensional offset quantity of a collet 23 for a reference portion 41. A control me...

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1. Verfasser:	TAKASU SEIICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a die bonder and a die bonding method capable of executing highly precise die bonding without being influenced by thermal deformation. SOLUTION: A detecting means 42 detects the three-dimensional offset quantity of a collet 23 for a reference portion 41. A control means 43 executes position correction equivalent to the offset quantity for the collet 23. The reference portion 41 is provided on one part of a bonding target holding section in the vicinity of a bonding target position. COPYRIGHT: (C)2009,JPO&INPIT