PLASMA TREATMENT DEVICE

PROBLEM TO BE SOLVED: To effectively utilize a plasma generation gas. SOLUTION: The plasma treatment device directly supplies the plasma generation gas on the surface of a treating object 2 through a plurality of through holes 6 that are formed on an electrode substrate 4. Thereby, by supplying the...

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Bibliographische Detailangaben
Hauptverfasser:	HIRAI TAKAHIKO, SHIBATA TETSUJI
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL PLASMA TECHNIQUE PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OFNEUTRONS PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMICBEAMS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION THEIR RELEVANT APPARATUS TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To effectively utilize a plasma generation gas. SOLUTION: The plasma treatment device directly supplies the plasma generation gas on the surface of a treating object 2 through a plurality of through holes 6 that are formed on an electrode substrate 4. Thereby, by supplying the plasma generation gas by an amount only necessary for surface treatment of the treating object 2, the plasma generation gas is effectively utilized and consumption amount of the plasma generation gas can be reduced. COPYRIGHT: (C)2009,JPO&INPIT