ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

PROBLEM TO BE SOLVED: To provide an electronic component whose bonding portion has superior conductivity and high temperature resistance, and to provide a manufacturing method thereof. SOLUTION: An alloy 31 which has glass transition temperature and crystallization temperature and also has an amorph...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SAKAMOTO HIRONORI, KUNO MASAKI, MAKUCHI YUTAKA
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide an electronic component whose bonding portion has superior conductivity and high temperature resistance, and to provide a manufacturing method thereof. SOLUTION: An alloy 31 which has glass transition temperature and crystallization temperature and also has an amorphous structure is disposed between a semiconductor chip 11 and a wiring layer 14, and while they are pressed, the alloy 31 is heated to the level of a temperature between the glass transition temperature and crystallization temperature to bond the semiconductor chip 11 and wiring layer 14 together. Then, the joined body thereof is further heated above the level of the crystallization temperature to crystallize the alloy 31. COPYRIGHT: (C)2009,JPO&INPIT